Ultra High Temperature
Clear-Amber, 1:1 two-part System for Tough Bonding Applications.
Single-part Contact Adhesive, Excellent Flexibility.
Aluminum-Filled, Low Shrinkage, High Thermal Conductivity, For Bonding and Molding Applications.
Single-part, Heat Curable, Silicone Elastomer Adhesive.
Ceramic-Filled, Low Expansion, High Lap-Shear Strength & Chemical Resistance, Low Outgassing.
High Temperature, Special Purpose
Aluminum-Filled, 1:1, High Bond Strength, Excellent Thermal Conductivity.
Clear-Amber, 1:1, High Bond Strength & Corrosion Resistance.
10 Minute Set, Non-Sagging, 1:1, Excellent Electrical & Mechanical Properties.
Clear, 1:1, 45-Minute Cure System with Good Flexibility.
Fast-Setting, Ceramic-Filled, High Vibration Resistance & Bond Strength.
High Temperature Potting Compounds
High Temperature Resistance, Thermally Conductive, Low Viscosity.
Similar to 2315 Providing Improved Crack Resistance & Bond Strength.
High Temperature, Low Viscosity, Room Temperature Cure.
High Temperature, Low Viscosity, Low Expansion, High Glass Transition Temperature & Chemical Resistance.
High Temperature, Maintenance and Repair
Stainless-Steel Filled, 1:1, High Bond Strength & Corrosion Resistance.
Glass Fiber & Kevlar-Reinforced, Epoxy-Novolac, High Strength & Excellent Abrasion & Corrosion Resistance.
Aluminum & Ceramic-Filled, Vibration & Impact Resistant; For Repairing Aluminum Mold & Wear Surfaces.
Ceramic-Filled, High Chemical Resistance, Machinable; For Repairing Deeply Corroded Parts.
Ultra High Bond Strength
Unfilled, Low Viscosity, Rubberized Epoxy, Exceptional Bond Strength & Chemical Resistance.
Ceramic-Filled, 1:1 two-part, High Lap Shear and Peel Strength, Autoclavable.
Toughened, Unfilled, Fast-Setting, BPA Free, 2:1, High Peel & Shear Strength.