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Aremco-Bond 2315 High Temp Potting Compound Now Available

March 20, 2015

Aremco-Bond™ 2315, a new high temperature, thermally conductive, epoxy-potting compound produced by Aremco Products, Inc., is now available for electrical and electronic potting applications to 365 ºF (185 ºC).

Aremco-Bond 2315 High Temp Potting Compound Now Available

Aremco-Bond™ 2315 is a low viscosity, black-pigmented, high temperature, epoxy compound used in electrical and electronic applications to 365 ºF (185 ºC). Additional features include high thermal conductivity, good electrical insulation, and low shrinkage after cure.

Aremco-Bond™ 2315 provides high flexural strength of 12,300 psi. Electrical properties include a volume resistivity of 1.0 x 1015, dielectric strength of 480 volts/mil, and dielectric constant of 4.7 at 1 kHz. Exceptional chemical resistance to acids, alkalis, organic fluids, and salts, is also provided.

Aremco-Bond™ 2315 is a 100% solids epoxy that is mixed in a ratio of 100 parts resin to 25 parts hardener by weight. Mixed viscosity is 3,000 cP and the pot life for a 100 gram mass is greater than 8 hours at room temperature. Recommended cure is 2 hours at 160 ºF plus 2 hours at 300 ºF. Alternative cure is 6 hours at 250 ºF. Cured product exhibits a linear shrinkage of .003 in/in and Shore-D hardness of 92.

Aremco-Bond™ 2315 is useful for potting and encapsulating densely packaged power supplies, rectifiers, integrated circuits, thick film hybrid devices, digital-analog converters, oscillators, amplifiers, relays, transformers, and semiconductors.

Aremco-Bond™ 2315 is supplied in easy to mix pint, quart and gallon kits. Please contact Aremco’s Technical Sales Department for more information about this advanced product, or read more.