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Aremco-Bond™ 820 High Temp Flexible Adhesive Now Available

August 14, 2012

Aremco-Bond™ 820, a high temperature, flexible epoxy system developed by Aremco Products, Inc., is now used for general purpose bonding of ceramics, glass, plastics, metals and other substrates for applications to 400 ºF (204 ºC).

Aremco-Bond™ 820 High Temp Flexible Adhesive Now Available

Aremco-Bond™820 is a clear, unfilled, 100% solids, 1-to-1 mix ratio, flexible epoxy system which can be used in applications to 400 ºF (204 ºC).

Flexural and tensile shear strengths are 8,000 and 1,200 psi, respectively. The volume resistivity is 2.0 x 1014 ohm-cm; dielectric strength is 860 volts per mil; and the dielectric constant is 6.0 at 1.0 kHz.

Aremco-Bond™ 820 exhibits exceptional adhesion to ceramics, glass, metals and plastics substrates, and demonstrates outstanding chemical resistance to acids, alkalis, organic fluids and salts.

Aremco-Bond™ 820 mixes easily in a 1-to-1 ratio, providing a mixed viscosity of 12,000 cps and cure time of 45 minutes at room temperature. The Shore-D hardness is 70 and shrinkage is less than .008 in/in upon curing.

Aremco-Bondt™ 820 is supplied in pre-filled 50ml dispense cartridges, as well as pint, quart, and gallon kits. Cartridges can be loaded to mechanical or pneumatic guns for automatic mixing and dispensing.

Please contact Aremco’s Sales Engineering Department for more information about this advanced epoxy formulation,