Aremco-Bond™ 556-HTSP is an advanced, two-part, screen printable, electrically conductive adhesive formulated using high purity silver flake. This system exhibits a volume resistivity of less than 0.0004 ohm-cm at room temperature, and a thermal conductivity of 2.2 W/m-°K. The continuous operating temperature range is 445 °F (230 °C) and intermittent use temperature is 570 °F (300 °C). The tensile shear strength is 1,400 psi and Shore D hardness is 88. Viscosity range is 35,000 to 45,000 cP.
Aremco-Bond™ 556-HTSP mixes easily in a 1-to-1 ratio by weight and cures in 1 hour at 350 °F. It comes in standard 50-gram kits but can be specially packaged in divided bi-packs or pre-mixed and frozen syringes upon request.
Typical applications for Aremco-Bond™ 556-HTSP include microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical and electronic components used in connectors, lighting and sensor components.
Please contact Aremco’s Technical Sales Department for more information about this advanced new product.