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Aremco-Bond™ 2318 High Temp Potting Compound Now Available

June 7, 2012

Aremco-Bond™ 2318, a new high temperature, thermally conductive, epoxy-potting compound produced by Aremco Products, Inc., is now available for electrical and electronic potting applications from –55 to +185 °C (-67 to 365 °F).

Aremco-Bond™ 2318 High Temp Potting Compound Now Available

Aremco-Bond™ 2318 is a medium viscosity, black-pigmented, high temperature epoxy compound used in electrical and electronic applications from –55 to +185 °C (-67 to 365 °F). Aremco-Bondtm 2318™ provides high flexural strength of 12,300 psi, tensile-shear strength of 1,135 psi, volume resistivity of 3.0 x 1015, dielectric strength of 460 volts/mil, and dielectric constant of 4.8 at 1 kHz. Exceptional chemical resistance to acids, alkalis, organic fluids, and salts, is also provided.

Aremco-Bond™ 2318 is a 100% solids epoxy that is mixed in a ratio of 100 parts resin to 12 parts hardener by weight. Mixed viscosity is 16,000 cP and the pot life for a 100 gram mass is 2 hours at room temperature. Recommended cure:4 hours at room temperature plus 2 hours at 200 °F. An alternative cure schedule is 24 hours at room temperature. Cured product exhibits a linear shrinkage of .003 in/in and a Shore-D hardness of 89.

Aremco-Bond™ 2318 is useful for potting and encapsulating densely packaged power supplies, rectifiers, integrated circuits, thick film hybrid devices, digital-analog converters, oscillators, amplifiers, relays, transformers, semiconductors, and electrical feed-thru bushings.

Aremco-Bond™ 2318 is supplied in easy to mix pint, quart and gallon kits. Please contact Aremco’s Technical Sales Department for more information about this advanced product.