Accu-Cut Dicing Saw Systems

Technical Bulletin E1

Aremco’s Accu-Cut™ dicing saws are used to cut a wide range of ultra-hard materials such as ceramics, ferrites and quartz, as well as semiconductor materials including silicon, gallium arsenide and bismuth telluride. Part sizes up to 6” x 6” can be accommodated to dice chips as small as .020” square. Two basic systems are offered:

Accu-Cut™ 5200
Accu-Cut Dicing Saw Systems
Product
Features

Accu-Cut™ 5200
The Accu-Cut™ Model 5200 is a compact, semi-automatic system for laboratory and production applications on substrates up to 4” x 4” x 3/4” thick. It comes equipped with a 5,000 rpm fixed speed spindle, a manual indexing Y-stage and an air/oil in-feed for maintaining smooth, precise stage control. Parts are mounted with a pneumatic vise or vacuum manifold to a 360° theta stage for part alignment, and a monocular microscope option is offered.

Accu-Cut™ 5255
The Accu-Cut™ Model 5255 is a fully-programmable system for cutting substrates as large as 6” x 6” x 1” thick in production quantities. It is equipped with a variable speed spindle with zero to 10,000 rpm control. Menu-driven software is included to enable the operator to enter a cut profile for repetitive dicing over a 6” range. Indexing is handled in steps of .0001” and the in-feed drive is controlled by an air/oil system for maintaining smooth, precise stage control.

 
  • Hybrid Circuits
  • Resistors and Capacitors
  • Read-Write Heads
  • Display Glass
  • Metal and Optical Crystals
  • Thermoelectrics
  • Advanced Ceramics
  • Piezoelectrics

Accu-Cut