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Wafer-Mount™ 559 Mounting Adhesive Now Available

November 5, 2010


Wafer-Mount™ 559, a new high strength, film adhesive produced by Aremco Products, Inc., is now used to bond advanced ceramics, circuit boards, optical components, and semiconductors for dicing and polishing operations.

Wafer-Mount™ 559 Mounting Adhesive Now Available

Aremco’s Wafer-Mount™ 559 is an advanced, semi-rigid, solvent-resistant, plastic film with pressure sensitive adhesive layer that provides exceptional mechanical and thermal stability, important requirements for machining operations that produce severe heat, vibration and peel stresses.

Wafer-Mount™ 559 is easy use by cutting to the desired shape, then peeling away the backing paper and affixing the adhesive film to a substrate. The film/substrate part is then mounted to a vacuum chuck for dicing or scribing operations. After use, the substrate is removed from the adhesive film by heating to 300 °F for 2-3 minutes to peel away the film. Residual adhesive is dissolved easily in a ketone-based solvent.

Wafer-Mount™ 559 is available in a convenient-to-use sheet that is 0.005” thick x 10″ x 10″.

Please contact Aremco’s Technical Sales Department for more information about this advanced new adhesive.