Aremco’s Wafer-Mount™ 559 is an advanced, semi-rigid, solvent-resistant, plastic film with pressure sensitive adhesive layer that provides exceptional mechanical and thermal stability, important requirements for machining operations that produce severe heat, vibration and peel stresses.
Wafer-Mount™ 559 is easy use by cutting to the desired shape, then peeling away the backing paper and affixing the adhesive film to a substrate. The film/substrate part is then mounted to a vacuum chuck for dicing or scribing operations. After use, the substrate is removed from the adhesive film by heating to 300 °F for 2-3 minutes to peel away the film. Residual adhesive is dissolved easily in a ketone-based solvent.
Wafer-Mount™ 559 is available in a convenient-to-use sheet that is 0.005” thick x 10″ x 10″.
Please contact Aremco’s Technical Sales Department for more information about this advanced new adhesive.