Aremco-Bond™ 556-HTHC is an advanced, two-part, electrically and thermally conductive, high temperature epoxy formulated using a high purity silver flake. This adhesive exhibits an exceptionally low volume resistivity of less than 0.0001 ohm-cm at room temperature and a thermal conductivity of 2.2 W/m-ºK. The continuous operating temperature range is 390 ºF (200 ºC) and intermittent use temperature is 480 ºF (250 ºC). The tensile shear strength is 1,700 psi and Shore D hardness is 90. Viscosity range is 40,000 to 45,000 cP.
Aremco-Bond™ 556-HTHC mixes easily in a 100-to-2 resin-to-hardener ratio by weight. It cures in 2 hours at 200 ºF or in 1 hour at 250 ºF. It comes in standard 50-gram kits and can be specially packaged in divided bi-packs or pre-mixed and frozen syringes upon request.
Typical applications for Aremco-Bond™ 556-HTHC include microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical and electronic components used in connectors, lighting and sensor components.
Please contact Aremco’s Technical Sales Department for more information about this advanced new product.