Aremco-Bond™ 860 is a two-component, 100% solids, aluminum nitride filled, thermally conductive epoxy, that is ideal for bonding and small encapsulation applications to 400 ºF (204 ºC). Aremco-Bond™ 860 exhibits excellent adhesion to a variety of high temperature plastics such as polyimides and composites, as well as ceramics, glass, and high expansion metals.
Aremco-Bond™ 860 is mixed in a ratio of 1 part base resin to 1 part activator by weight and cures in 24 hours at room temperature or in 2 hours at 200 °F. After curing, it exhibits a thermal conductivity of 8.5 Btu-in/hr-ft²-°F and dielectric strength of 250 volts/mil. The tensile shear strength is 1,375 psi. This system also demonstrates very good corrosion protection and thermal shock resistance.
Typical applications for Aremco-Bond™ 860 include the bonding of heat sinks and fins used in heat exchangers and electrical/electronic assemblies. Aremco-Bond™ 860 is supplied in pre-measured pint, quart, gallon and five gallon kits from stock.
Please contact Aremco’s Technical Sales Department for more information about this advanced thermally conductive product.