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Aremco-Bond™ 556-HTSP Electrically Conductive Adhesive Now Available

February 12, 2012


Aremco-Bond™ 556-HTSP, a new silver-filled, screen printable, high temperature, electrically and thermally conductive adhesive developed by Aremco Products, Inc., is now used for microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical and electronic assembly applications to 445 °F (230 °C).

Aremco-Bond™ 556-HTSP Electrically Conductive Adhesive Now Available

Aremco-Bond™ 556-HTSP is an advanced, two-part, screen printable, electrically conductive adhesive formulated using high purity silver flake. This system exhibits a volume resistivity of less than 0.0004 ohm-cm at room temperature, and a thermal conductivity of 2.2 W/m-°K. The continuous operating temperature range is 445 °F (230 °C) and intermittent use temperature is 570 °F (300 °C). The tensile shear strength is 1,400 psi and Shore D hardness is 88. Viscosity range is 35,000 to 45,000 cP.

Aremco-Bond™ 556-HTSP mixes easily in a 1-to-1 ratio by weight and cures in 1 hour at 350 °F. It comes in standard 50-gram kits but can be specially packaged in divided bi-packs or pre-mixed and frozen syringes upon request.

Typical applications for Aremco-Bond™ 556-HTSP include microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical and electronic components used in connectors, lighting and sensor components.

Please contact Aremco’s Technical Sales Department for more information about this advanced new product.