Macor®
Machinable Glass Ceramic
-
is MACHINABLE with ordinary metal working tools.
-
allows FAST TURNAROUND, no post firing required.
-
holds TIGHT TOLERANCES, up to .0005".
-
withstands HIGH TEMPERATURE, up to 1000°C
(no load).
-
is CLEAN, no outgasing and zero porosity.
With Macor® Machinable Glass Ceramic (MGC),
fabrication is fast - because it can be machined
into complicated shapes and precision parts with
ordinary metal working tools, quickly and inexpensively,
and it requires no post firing after machining.
That means no frustrating delays, no expensive
hardware, no post fabrication shrinkage, and no
costly diamond tools to meet specifications.
Properties
Macor®
Machinable Glass Ceramic has a continuous use
temperature of 800°C and a peak temperature
of 1000° C. It's coefficient of thermal expansion
readily matches most metals and sealing glasses.
It is non-wetting; exhibits zero porosity, and
unlike ductile materials, won't deform. It is
an excellent insulator at high voltages, various
frequencies and high temperatures. And, when properly
baked out, it won't outgas in vacuum environments.
Machining
Machining
tolerances are surprisingly tight, up to .0005".
It can be machined to a surface finish of less
than 20?in. and polished to a smoothness of 0.5?in
-AA. Configurations are limited only by available
equipment and the experience of the machinist
Sealing,
Joining and Metalizing
Macor®
MGC can also be joined or sealed - both to itself
and to other materials - in a number of ways:
metalized parts can be soldered together and brazing
has proven an effective method of joining the
material to various metals; epoxy produces a strong
joint, and sealing glass creates a vacuum tight
seal Even a straightforward mechanical joint is
possible. It can be thick film metalized using
metal inks, or thin film metalized by sputtering.
Applications
Ultra-High
Vacuum Environments:
Macor® Machinable Glass Ceramic is used as an
insulator or coil support and for vacuum feed-throughs.
In these applications the conductive materials are
supported by the Macor® MGC part and a compatible
sealing glass is used to produce a vacuum-tight,
hermetic seal.
Constant Vacuum Applications
Macor® MGC parts are found in spacers, headers
and windows for microwave tube devices and as
sample holders in field ion microscopes.
Aerospace lndustry
Over 200 distinctly shaped Macor® MGC parts
can be found on America's reusable Space Shuttle
Orbiter. Retaining rings of Macor® MGC are
used at all hinge points, windows and doors.
Also,
large pieces of Macor® glass ceramic are used
in a NASA spaceborne gamma radiation detector.
For this application frame corners are joined
by a combination of machined (butt-lap) mechanical
joints and a sealing glass.
Nuclear-Related Experiments
Since Macor® MGC is not dimensionally affected
by irradiation, small cubes of the material are
machined to a tolerance of one micron and are
used as a reference piece to measure dimensional
change in other materials.
Welding Nozzles
Welding equipment manufacturers are using Macor®
MGC as a nozzle on the tips of oxyacetylene torches.
The material's nonwetting characteristic means
molten particles won't adhere to and decrease
the effectiveness of the nozzle.
Fixtures
Macor® MGC is used as an electrode support
and burner block in several industrial high heat,
electrical cutting operations due to its low thermal
conductivity and excellent electrical properties.
Medical Equipment
Producers of medical components are intrigued
by Macor® MGC's inertness, precise machinability
and dimensional stability.
The
Point is this:
When you need the performance of a technical ceramic
(high use temperature, electrical resistivity,
zero porosity) -and your application demands the
ready fabrication of a complicated shape - (quickly,
precisely, privately), look at Macor® MGC.
It will lower costs and substantially reduce the
time between design and actual use.
Properties
l. Thermal
| |
SI/Metric |
English |
| Coefficient
of Expansion |
|
|
| -200
- 25º C |
74
x 10- 7/ º C |
41
x 10- 7/º F |
| 25
- 300º C |
93
x 10- 7/
º C |
52
x 10- 7/º
F |
| 25
- 600º C |
114
x 10- 7/
º C |
63 x 10- 7/º
F |
| 25
- 800º C |
126
x 10- 7/
º C |
70
x 10- 7/º
F |
| Specific
Heat, 25º C |
.79
KJ /kg º C |
0.19 Btu/lbº F |
| Thermal
Conductivity, 25º C |
1.46
W/mº C |
10.16 Btu in / hrft2 ºF |
| Thermal
Diffusivity, 25º C |
7.3
x 10- 7m2/
s |
0.028
ft2/hr |
| Continuous
Operating Temperature |
800º
C |
1472º
F |
| Maximum
No Load Temperature |
1000º
C |
1832º
F |
II.
Mechanical
| |
SI/Metric |
English |
| Density |
2.52
g/cm3 |
157
lbs/ft3 |
| Porosity |
0% |
0% |
Young's
Modulus, 25º C
(Modulus of Elasticity) |
66.9
GPa |
9.7x106
psi |
| Poisson's
Ratio |
0.29 |
0.29 |
| Shear
Modulus, 25º C |
25.5
GPa |
3.7x106
psi |
| Hardness,
Knoop 100g |
250 |
250 |
| Hardness,
Rockwell A |
48 |
48 |
| Modulus
of Rupture, 25º C |
94
Mpa |
13,600
psi |
| (Flexural
Strength) |
(minimum
specified average value) |
| Compressive
Strength |
345
Mpa |
50,000
psi |
| Fracture
Toughness |
1.53
MPa m0.5 |
1,390
psi in 0.5 |
III.
Electrical
| |
SI/Metric |
English |
| Dielectric
Constant, 25º C |
|
|
| 1
KHz |
6.03 |
6.03 |
| 8.5
GHz |
5.67 |
5.67 |
| Loss
Tangent. 25º C |
|
|
| 1
KHz |
4.7
x 10-3 |
4.7 x 10-3 |
| 8.5
GHz |
7.l
x 10-3 |
7.l
x 10-3 |
| Dielectric
Strength. AC or DC |
40
KV/mm |
1000V/mil |
| (at
.01" thickness, 25º C) |
|
|
| DC
Volume Resistivity, 25º C |
>1016
ohm-cm |
>1016
ohm-c |
IV.
Chemical
| Tests |
Results |
| Solution |
pH |
Time |
Temp.
|
Weight
Loss
(mg/cm2)
Gravimetric |
5%
HCL
(Hydrochloric Acid)
|
0.1 |
24
hrs. |
95º
C |
~
100 |
0.002
N HNO3
(Nitric Acid) |
2.8 |
24
hrs. |
95º
C |
~
0.6 |
0.1
N NaHC03
(Sodium Bicarbonate) |
8.4 |
24
hrs. |
95º
C |
~0.3 |
0.02
N Na2CO3
(Sodium Carbonate) |
10.9 |
6
hrs. |
95º
C |
~0.1 |
5%
NaOH
(Sodium Hydroxide) |
13.2 |
6
hrs. |
95º
C |
~10 |
Resistance
to water over time
| H20 |
7.6 |
1
day* |
95º
C |
0.01 |
| |
|
3
days* |
95º
C |
0.07 |
| |
|
7
days* |
95º
C |
9.4 |
| |
|
3
days** |
95º
C |
0.06 |
| |
|
6
days** |
95º
C |
0.11 |
* Water not freshened daily
**Water freshened daily
Machining
Key factors for successful machining
are proper machining speeds and coolant.
Macor®
Machinable Glass Ceramic can be machined with
high-speed steel tools, but carbide tools are
recommended for longer wear.
Achieve
the best results by using a water-soluble coolant,
such as Cimstar 40 - Pink, especially formulated
for cutting and grinding glass or ceramics.
No
post firing is required after machining.
SAWING
Use a carbide grit blade at a band speed of 700
fpm. An after-native is a silicon carbide or diamond
cut-off wheel.
TURNING
Cutting
speed |
30-50
sfm |
Feedrate |
.002-.005 ipr |
Depth
of cut |
.1
50-.250 in. |
MILLING
| Cutting
speed |
20-35
sfm |
| Chip
load |
.002
ipt |
| Depth
of cut |
.150-.200
in. |
DRILLING
| Drill
size |
Spindle
speed |
Feedrate |
| 1/4 |
300
rpm |
.005
ipr |
| 1/2 |
250 |
.007 |
| 3/4 |
200 |
.010 |
| 1 |
100 |
.012 |
| 2
|
50 |
.015 |
Allow at least .050" of extra material on
the backside for breakout. This excess can be
removed after drilling.
TAPPING
Make clearance holes one size larger than those
recommended for metals. Chamfer both ends of the
hole to reduce chipping. Run the tap in one direction
only. Turning the tap back and forth can cause
chipping. Continuously flush with water or coolant
to clear chips and dust from the tap.
GRINDING
Diamond, silicon -carbide or aluminum-oxide grinding
wheels can be used.
POLISHING
Start with loose 400-grit silicon carbide on a
steel wheel. For the final polish, use cerium
oxide or alumina on a polishing pad for glass
or ceramics. A 0. 0.5 ?in. -AA finish can be achieved.
Composition
Macor®
Machinable Glass Ceramic is a white, odorless,
porcelain like (in appearance) material composed
of approximately 55% fluorophlogopite mica and
45% borosilicate glass. It has no known toxic
effects; however, the dust created in machining
can be an irritant. This irritation can be avoided
by good housekeeping and appropriate machining
techniques. The material contains the following
compounds:
Approximate Weight %
Silicon
- Si02 46%
Magnesium- MgO 17%
Aluminum - Al203 16%
Potassium - K20 10%
Boron - B203 7%
Fluorine -F 4%
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